Electron Beam viewing screen

Phosphor Viewing Screens for Electron-Beam imaging
Description

Phosphor Viewing screens -

Phosphor viewing screens can be designed to the exact requirements of your application. We can provide bonded fibre optic scintillators (FOS) and phosphor viewing screens to CMOS and CCD cameras. A  a turn-key solution can be provided by bonding your sensor and scintillator together. 

 

-Substrate: float glass or other type; fibre optic faceplates (FOP); aluminium plates or more complex shapes machined to customer requirements.  Coating of PET sheets down to 3um thick is also possible. The size of the substrate typically ranges from 10mm to 150mm square or equivalent circle diameter. Special shapes such as prisms and tapers can also be processed.

-Undercoat: dielectric substrates, such as float glass or fibre optic faceplates (FOPs), can be ITO-coated for electrical connection of the screen to the instrument. As an indication, surface resistivity of 200 ohm/sq can be achieved with ITO-coating.

-Phosphor layer. P22, P22G, P24, P43, P46, P47 but a wider range of other phosphors is available on request. Coating thickness for SEM/TEM and MS applications would typically vary from 3um to 100um, Average particle size of the phosphor may range from 1.5um, for high-resolution screens, to 25um for applications where high brightness and efficiency are paramount.

-Fingerprint-resistant phosphor layer. Phosphor viewing screens are usually irreversibly damaged even by a slight finger touch. However, a process based on potassium silicate, sometimes referred to as “waterglass”, can be provided on request for applications requiring higher mechanical stability. The potassium silicate process produces coatings which can withstand a light touch by hand.

-Aluminium over-layer can be added on demand to reduce stray-light and to channel all the photons generated into the phosphor layer towards the detector. As a rule of thumb, a 50-100nm aluminium over-layer requires a 3Kv minimum acceleration voltage for electrons to pass through. The aluminium layer serves also as a conductive coating.  

-Scintillator-camera Bonding. A bonding process can utilise fibre optic plates (FOPs) from 1.5 to 100mm thick. In-house bonding jig design is capable of producing single sensor products or multiple sensor arrays. A proprietary process reduces the risk of trapped bubbles and particles within the glue line.

Typical Applications

 

– Electron Microscopy (SEM/TEM)

– Mass Spectrometry (MS)

– Electron Back Scatter Diffraction (EBSD)

– Low Energy Electron Diffraction (LEED)

– Reflexion High Energy Electron Diffraction (RHEED)

 

 

Contact

Geebee International
12 - A, Lane W - 16,
Sainik Farms,
New Delhi - 110062
+91 98107 54666, +91 11 4301 4983

info@geebeeinternational.com